| Gasket |
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- Application: Bumping process (electroplating)
- Gasket for 8กจ wafer: Compound V6017
- Gasket for 12กจ wafer: Compound TV6004
- Excellent chemical resistance
- Perfect sealing application for bomping process
- High chemical resistance
Perfect sealing application for the process
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FOR DETAIL PRODUCT INQUIRIES, PLEASE SEND EMAIL  mfc@mail.mfc.com.tw TO US. |
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